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  • Manufacturer No:
    2N6802
  • Manufacturer:
    Microsemi Corporation
  • Category:
    Transistors - FETs, MOSFETs - Single
  • Datasheet:
    2N6802
  • SKU:
    9736499
  • Description:
    MOSFET N-CH 500V TO-205AF TO-39

2N6802 Details

MOSFET N-CH 500V TO-205AF TO-39

2N6802 Specification Parameters

  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mounting Type: Through Hole
  • Number of Elements: 1
  • Part Status: Obsolete
  • Number of Pins: 3
  • Drive Voltage (Max Rds On,Min Rds On): 10V
  • Drain to Source Voltage (Vdss): 500V
  • Gate to Source Voltage (Vgs): 20V
  • Operating Temperature: -55°C~150°C TJ
  • Technology: MOSFET (Metal Oxide)
  • Transistor Application: SWITCHING
  • Operating Mode: ENHANCEMENT MODE
  • Configuration: SINGLE WITH BUILT-IN DIODE
  • Subcategory: FET General Purpose Power
  • Drain-source On Resistance-Max: 1.6Ohm
  • Package / Case: TO-205AD, TO-39-3 Metal Can
  • Power Dissipation-Max: 800mW Ta 25W Tc
  • Rds On (Max) @ Id, Vgs: 1.5 Ω @ 1.5A, 10V
  • Packaging: Bulk
  • Mount: Through Hole
  • RoHS Status: Non-RoHS Compliant
  • Number of Terminations: 3
  • Terminal Form: WIRE
  • Transistor Element Material: SILICON
  • DS Breakdown Voltage-Min: 500V
  • Terminal Position: BOTTOM
  • FET Type: N-Channel
  • Published: 1997
  • Continuous Drain Current (ID): 2.5A
  • Vgs (Max): ±20V
  • Case Connection: DRAIN
  • Vgs(th) (Max) @ Id: 4V @ 250μA
  • HTS Code: 8541.21.00.95
  • Current - Continuous Drain (Id) @ 25°C: 2.5A Tc
  • JEDEC-95 Code: TO-205AF
  • Gate Charge (Qg) (Max) @ Vgs: 4.46nC @ 10V

Microsemi Corporation — Manufacturer Introduction

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

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