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232-1285-19-0602J123
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232-1285-19-0602J
  • Manufacturer No:
    232-1285-19-0602J
  • Manufacturer:
    3M
  • Category:
    Sockets for ICs, Transistors - Adapters
  • Datasheet:
    232-1285-19-0602J
  • SKU:
    2071311
  • Description:
    RECEPTACLE DIP SOCKET 32POS .6"

232-1285-19-0602J Details

RECEPTACLE DIP SOCKET 32POS .6"

232-1285-19-0602J Specification Parameters

  • Part Status: Active
  • Mounting Type: Through Hole
  • Contact Finish - Mating: Gold
  • Contact Finish - Post: Gold
  • Operating Temperature: -55°C~125°C
  • Material Flammability Rating: UL94 V-0
  • Pitch - Mating: 0.100 2.54mm
  • Gender: Female
  • Pitch: 2.54mm
  • Contact Finish Thickness - Post: 30.0μin 0.76μm
  • Max Operating Temperature: 150°C
  • Current Rating (Amps): 1A
  • Number of Pins: 32
  • Contact Material - Mating: Beryllium Copper
  • Contact Material: Copper
  • Mount: Wire
  • Termination Post Length: 0.620 15.75mm
  • Convert From (Adapter End): DIP, 0.6 (15.24mm) Row Spacing
  • Series: Textool?
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • RoHS Status: RoHS Compliant
  • Contact Plating: Gold
  • Lead Free: Lead Free
  • Min Operating Temperature: -55°C
  • Flammability Rating: UL94 V-0
  • Pitch - Post: 0.100 2.54mm
  • Factory Lead Time: 8 Weeks
  • Contact Finish Thickness - Mating: 30.0μin 0.76μm
  • Published: 2011
  • Current Rating: 1A
  • Number of Positions: 32
  • Number of Contacts: 32
  • Contact Material - Post: Beryllium Copper
  • Termination: Wire Wrap
  • Feature: Closed Frame
  • Convert To (Adapter End): DIP, 0.6 (15.24mm) Row Spacing
  • Weight: 453.59237g
  • Housing Material: Polysulfone (PSU), Glass Filled

3M — Manufacturer Introduction

3M
3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M? Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak? High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX? and SLA modeling - 3M's experienced engineers turn ideas into real world solutions. 3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool? Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.

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