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- Manufacturer No：DMP2215L-7
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：DMP2215L-7
- SKU：1771820
- Description：MOSFET P-CH 20V 2.7A SOT23-3
User Guide
User Guide
DMP2215L-7 Details
MOSFET P-CH 20V 2.7A SOT23-3
DMP2215L-7 Specification Parameters
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Number of Channels: 1
- Pbfree Code: yes
- JESD-609 Code: e3
- Contact Plating: Tin
- Terminal Position: DUAL
- Number of Pins: 3
- Terminal Form: GULL WING
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 40
- Transistor Element Material: SILICON
- Height: 1mm
- DS Breakdown Voltage-Min: 20V
- Length: 2.9mm
- Width: 1.3mm
- Operating Mode: ENHANCEMENT MODE
- Additional Feature: HIGH RELIABILITY
- Resistance: 100mOhm
- Vgs (Max): ±12V
- Power Dissipation: 1.08W
- Vgs(th) (Max) @ Id: 1.25V @ 250μA
- Input Capacitance (Ciss) (Max) @ Vds: 250pF @ 10V
- Power Dissipation-Max: 1.08W Ta
- Threshold Voltage: -890mV
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- Radiation Hardening: No
- Lead Free: Lead Free
- Part Status: Obsolete
- Number of Terminations: 3
- Pin Count: 3
- REACH SVHC: No SVHC
- Gate to Source Voltage (Vgs): 12V
- Published: 2009
- Element Configuration: Single
- Drain to Source Voltage (Vdss): 20V
- Operating Temperature: -55°C~150°C TJ
- Technology: MOSFET (Metal Oxide)
- Transistor Application: SWITCHING
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Subcategory: Other Transistors
- FET Type: P-Channel
- Weight: 7.994566mg
- Drive Voltage (Max Rds On,Min Rds On): 2.5V 4.5V
- Current - Continuous Drain (Id) @ 25°C: 2.7A Ta
- Continuous Drain Current (ID): -2.7A
- Gate Charge (Qg) (Max) @ Vgs: 5.3nC @ 4.5V
- Rds On (Max) @ Id, Vgs: 100m Ω @ 2.7A, 4.5V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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