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MC68LC060ZU75123
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MC68LC060ZU75
  • Manufacturer No:
    MC68LC060ZU75
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Embedded - Microprocessors
  • Datasheet:
    MC68LC060ZU75
  • SKU:
    10897775
  • Description:
    FIXED POINT MICROPROCESSOR Coldfire BALL IC Microprocessor 70C 6.718043g 3.3V 32b

MC68LC060ZU75 Details

FIXED POINT MICROPROCESSOR Coldfire BALL IC Microprocessor 70C 6.718043g 3.3V 32b

MC68LC060ZU75 Specification Parameters

  • Number of Cores: 1
  • Radiation Hardening: No
  • Low Power Mode: YES
  • Integrated Cache: YES
  • Operating Supply Voltage: 3.3V
  • Lead Free: Contains Lead
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 30
  • Address Bus Width: 32
  • Min Operating Temperature: 0°C
  • Terminal Finish: TIN LEAD
  • Supply Voltage-Max (Vsup): 3.465V
  • Frequency (Max): 75MHz
  • Format: FIXED POINT
  • Number of Terminations: 304
  • Halogen Free: Not Halogen Free
  • Core Architecture: Coldfire
  • RoHS Status: RoHS Compliant
  • Surface Mount: YES
  • Boundary Scan: YES
  • Supply Voltage: 3.3V
  • Moisture Sensitivity Level (MSL): 3
  • JESD-609 Code: e0
  • Max Operating Temperature: 70°C
  • Bit Size: 32
  • Terminal Position: BOTTOM
  • Terminal Form: BALL
  • Data Bus Width: 32b
  • Frequency: 75MHz
  • Peak Reflow Temperature (Cel): 220
  • Pin Count: 304
  • Number of Pins: 304
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR
  • Weight: 6.718043g

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor, Inc. (NXP Semiconductors)
Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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