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MPC8541PXAQF123
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MPC8541PXAQF
  • Manufacturer No:
    MPC8541PXAQF
  • Manufacturer:
    Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Category:
    Embedded - Microprocessors
  • Datasheet:
    MPC8541PXAQF
  • SKU:
    10862887
  • Description:
    FLOATING POINT MICROPROCESSOR RISC BOTTOM BALL IC Microprocessor 105C 29mm 1.2V 32b

MPC8541PXAQF Details

FLOATING POINT MICROPROCESSOR RISC BOTTOM BALL IC Microprocessor 105C 29mm 1.2V 32b

MPC8541PXAQF Specification Parameters

  • Number of Cores: 1
  • Radiation Hardening: No
  • Low Power Mode: YES
  • Integrated Cache: YES
  • Lead Free: Contains Lead
  • Technology: CMOS
  • Max Operating Temperature: 105°C
  • Terminal Position: BOTTOM
  • Min Operating Temperature: 0°C
  • Operating Supply Voltage: 1.2V
  • Temperature Grade: OTHER
  • Supply Voltage: 1.3V
  • Frequency: 1GHz
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
  • Subcategory: Microprocessors
  • Package / Case: FCBGA
  • Number of Terminations: 783
  • Pin Count: 783
  • Terminal Finish: Tin/Lead/Silver (Sn/Pb/Ag)
  • RoHS Status: RoHS Compliant
  • Surface Mount: YES
  • Boundary Scan: YES
  • Moisture Sensitivity Level (MSL): 3
  • JESD-609 Code: e0
  • Time@Peak Reflow Temperature-Max (s): 30
  • Bit Size: 32
  • Address Bus Width: 64
  • Terminal Form: BALL
  • Peak Reflow Temperature (Cel): 245
  • Data Bus Width: 32b
  • Length: 29mm
  • Frequency (Max): 1GHz
  • Halogen Free: Not Halogen Free
  • Format: FLOATING POINT
  • Height Seated (Max): 3.75mm
  • Number of Pins: 783
  • ECCN Code: 5A992
  • Weight: 4.31131g

Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction

Freescale Semiconductor, Inc. (NXP Semiconductors)
Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.

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