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- Manufacturer No：HYB25L256160AC-7.5
- Manufacturer：Infineon
- Category：
- Datasheet：HYB25L256160AC-7.5
- SKU：10938377
- Description：
User Guide
User Guide
HYB25L256160AC-7.5 Details
HYB25L256160AC-7.5 Specification Parameters
- Number of Functions: 1
- ECCN Code: EAR99
- Surface Mount: YES
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- Qualification Status: Not Qualified
- Memory Width: 16
- Supply Voltage: 2.5V
- Terminal Finish: Tin/Lead (Sn/Pb)
- Supply Voltage-Max (Vsup): 3.6V
- Terminal Pitch: 0.8mm
- Terminal Form: BALL
- Width: 8mm
- Pin Count: 54
- Supply Voltage-Min (Vsup): 2.3V
- I/O Type: COMMON
- Refresh Cycles: 8192
- Additional Feature: AUTO/SELF REFRESH
- Sequential Burst Length: 1248FP
- Organization: 16MX16
- Supply Current-Max: 0.18mA
- Access Mode: FOUR BANK PAGE BURST
- Memory IC Type: SYNCHRONOUS DRAM
- Power Supplies: 1.82.5V
- Number of Ports: 1
- RoHS Status: Non-RoHS Compliant
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Temperature Grade: COMMERCIAL
- JESD-609 Code: e0
- Technology: CMOS
- Operating Temperature (Max): 70°C
- Reach Compliance Code: compliant
- Terminal Position: BOTTOM
- Seated Height-Max: 1.2mm
- Output Characteristics: 3-STATE
- Length: 12mm
- Number of Terminals: 54
- Operating Mode: SYNCHRONOUS
- Clock Frequency: 133MHz
- Access Time (Max): 7.5 ns
- Interleaved Burst Length: 1248
- Memory Density: 268435456 bit
- Subcategory: DRAMs
- HTS Code: 8542.32.00.24
- JESD-30 Code: R-PBGA-B54
- Standby Current-Max: 0.0007A
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Infineon — Manufacturer Introduction
Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future.
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