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SG140-12K/883B123
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SG140-12K/883B
  • Manufacturer No:
    SG140-12K/883B
  • Manufacturer:
    Microsemi Corporation
  • Category:
    PMIC - Voltage Regulators - Linear
  • Datasheet:
    SG140-12K/883B
  • SKU:
    13544963
  • Description:
    Bulk Through Hole Non-RoHS Compliant Tin/Lead (Sn/Pb) voltage regulator linear 2V 6mA 125C

SG140-12K/883B Details

Bulk Through Hole Non-RoHS Compliant Tin/Lead (Sn/Pb) voltage regulator linear 2V 6mA 125C

SG140-12K/883B Specification Parameters

  • Number of Terminations: 2
  • Packaging: Bulk
  • Number of Functions: 1
  • ECCN Code: EAR99
  • Min Operating Temperature: -55°C
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Number of Pins: 3
  • Qualification Status: Not Qualified
  • Voltage - Output: 12V
  • Reach Compliance Code: not_compliant
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • Polarity: Positive
  • Part Status: Discontinued
  • Terminal Position: BOTTOM
  • Max Input Voltage: 35V
  • Accuracy: 2 %
  • Lifecycle Status: OBSOLETE (Last Updated: 1 month ago)
  • Pin Count: 2
  • Mount: Through Hole
  • Number of Outputs: 1
  • RoHS Status: Non-RoHS Compliant
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Max Operating Temperature: 125°C
  • Radiation Hardening: Yes
  • JESD-609 Code: e0
  • Output Voltage 1: 12V
  • Voltage Tolerance-Max: 5%
  • Terminal Form: PIN/PEG
  • Output Type: Fixed
  • Dropout Voltage1-Nom: 2V
  • Technology: BIPOLAR
  • Subcategory: Other Regulators
  • Quiescent Current: 6mA
  • JESD-30 Code: O-MBFM-P2

Microsemi Corporation — Manufacturer Introduction

Microsemi Corporation
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

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