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FFSD-05-S-06.00-01-N123
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FFSD-05-S-06.00-01-N
  • Manufacturer No:
    FFSD-05-S-06.00-01-N
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Cable Assemblies
  • Datasheet:
    FFSD-05-S-06.00-01-N
  • SKU:
    1659338
  • Description:
    CABLE ASSEM .05" 10PS SGL END 6"

FFSD-05-S-06.00-01-N Details

CABLE ASSEM .05" 10PS SGL END 6"

FFSD-05-S-06.00-01-N Specification Parameters

  • Part Status: Active
  • Number of Rows: 2
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Moisture Sensitivity Level (MSL): Not Applicable
  • Reliability: COMMERCIAL
  • Contact Finish Thickness: 10.0μin 0.25μm
  • Shielding: Unshielded
  • Subcategory: Headers and Edge Type Connectors
  • Number of Positions: 10
  • Pitch - Connector: 0.050 1.27mm
  • Contact Material: Copper
  • Mounting Option 1: LOCKING
  • Cable Termination: IDC
  • Contact Style: SQ PIN-SKT
  • Body/Shell Style: PLUG
  • Wire/Cable Gauge: 30 AWG
  • Color: Gray, Ribbon
  • Feature: Polarizing Key
  • Contact Design: PREASSEM CONN
  • Connector Type: Socket to Cable
  • Insulation Material: POLYBUTYLENE TEREPHTHALATE
  • Series: Tiger Eye? FFSD
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • Radiation Hardening: No
  • Contact Finish: Gold
  • Lead Free: Lead Free
  • Min Operating Temperature: -40°C
  • REACH SVHC: No SVHC
  • Number of Contacts: 5
  • Gender: Receptacle
  • Reference Standard: UL
  • Max Operating Temperature: 105°C
  • Polarization Key: POLARIZED HOUSING
  • Contact Pattern: STAGGERED
  • Max Current Rating: 500mA
  • Termination: IDT
  • Wire/Cable Type: Flat Flex
  • Pitch - Cable: 0.025 0.64mm
  • Withdrawl Force-Min: .834 N
  • Insertion Force-Max: 1.39 N
  • Length: 0.500' 152.40mm 6.00
  • Cable Length: 152mm
  • Connector Type A: Connector, IDC, Receptacle

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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