XCKU115-3FLVA2104EXilinx
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    XCKU115-3FLVA2104E
    • Manufacturer No：
      XCKU115-3FLVA2104E
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - FPGAs (Field Programmable Gate Array)
    • Datasheet：
      XCKU115-3FLVA2104E
    • SKU：
      5164084
    • Description：
      CMOS 2012 ROHS3Compliant BALL field programmable gate array 0C~100C TJ 9.3MB 1V 3.71mm

    User Guide

    User Guide

    XCKU115-3FLVA2104E Details

    CMOS 2012 ROHS3Compliant BALL field programmable gate array 0C~100C TJ 9.3MB 1V 3.71mm

    XCKU115-3FLVA2104E Specification Parameters

    • Part Status: Active
    • Mounting Type: Surface Mount
    • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
    • Packaging: Tray
    • Qualification Status: Not Qualified
    • Published: 2012
    • HTS Code: 8542.39.00.01
    • Terminal Form: BALL
    • Power Supplies: 1V
    • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
    • Subcategory: Field Programmable Gate Arrays
    • Width: 40mm
    • Operating Temperature: 0°C~100°C TJ
    • Number of Inputs: 832
    • ECCN Code: 3A001.A.7.B
    • Height Seated (Max): 3.71mm
    • Number of CLBs: 5520
    • Number of LABs/CLBs: 82920
    • Number of Logic Elements/Cells: 1451100
    • Organization: 5520 CLBS
    • RoHS Status: ROHS3 Compliant
    • Surface Mount: YES
    • Peak Reflow Temperature (Cel): NOT SPECIFIED
    • Factory Lead Time: 10 Weeks
    • Technology: CMOS
    • Terminal Pitch: 1mm
    • Terminal Position: BOTTOM
    • Supply Voltage: 1V
    • JESD-609 Code: e1
    • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
    • Length: 40mm
    • Moisture Sensitivity Level (MSL): 4 (72 Hours)
    • Number of I/O: 832
    • Number of Outputs: 832
    • Package / Case: 2104-BBGA, FCBGA
    • Series: Kintex? UltraScale?
    • JESD-30 Code: S-PBGA-B2104
    • Voltage - Supply: 0.970V~1.030V
    • Total RAM Bits: 77721600
    • RAM Size: 9.3MB
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    Xilinx — Manufacturer Introduction

    Xilinx
    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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