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  • Manufacturer No:
    FFSD-05-D-10.00-01-N
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Cable Assemblies
  • Datasheet:
    FFSD-05-D-10.00-01-N
  • SKU:
    1649319
  • Description:
    .050 X .050 C.L. FEMALE IDC ASSE

FFSD-05-D-10.00-01-N Details

.050 X .050 C.L. FEMALE IDC ASSE

FFSD-05-D-10.00-01-N Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Number of Rows: 2
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Option: GENERAL PURPOSE
  • Contact Finish Thickness: 10.0μin 0.25μm
  • Shielding: Unshielded
  • Gender: Receptacle
  • Number of Cores: 10
  • Max Operating Temperature: 105°C
  • Contact Material: Copper
  • Cable Termination: IDC
  • Termination: IDT
  • Connector Type: Socket to Socket
  • Pitch - Cable: 0.025 0.64mm
  • Feature: Polarizing Key
  • Length: 0.833' 254.00mm 10.00
  • Connector Type B: Connector, IDC, Receptacle
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Packaging: Bulk
  • Radiation Hardening: No
  • Contact Finish: Gold
  • Min Operating Temperature: -40°C
  • REACH SVHC: No SVHC
  • Mating Information: MULTIPLE MATING PARTS AVAILABLE
  • Total Number of Contacts: 10
  • Pitch - Connector: 0.050 1.27mm
  • Additional Feature: POLARIZED
  • Mounting Type: Cable
  • Max Current Rating: 500mA
  • Wire/Cable Type: Flat Flex
  • Wire/Cable Gauge: 30 AWG
  • Color: Gray, Ribbon
  • Cable Length: 254mm
  • Connector Type A: Connector, IDC, Receptacle
  • Series: Tiger Eye? FFSD

Samtec Inc. — Manufacturer Introduction

Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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