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DMN26D0UDJ-7123
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DMN26D0UDJ-7
  • Manufacturer No:
    DMN26D0UDJ-7
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Transistors - FETs, MOSFETs - Arrays
  • Datasheet:
    DMN26D0UDJ-7
  • SKU:
    1723609
  • Description:
    MOSFET 2N-CH 20V 0.24A SOT963

DMN26D0UDJ-7 Details

MOSFET 2N-CH 20V 0.24A SOT963

DMN26D0UDJ-7 Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mounting Type: Surface Mount
  • ECCN Code: EAR99
  • Radiation Hardening: No
  • Lead Free: Lead Free
  • Number of Pins: 6
  • REACH SVHC: No SVHC
  • Terminal Finish: Matte Tin (Sn)
  • Time@Peak Reflow Temperature-Max (s): 40
  • Transistor Element Material: SILICON
  • Drain to Source Voltage (Vdss): 20V
  • Packaging: Cut Tape (CT)
  • Transistor Application: SWITCHING
  • Height: 450μm
  • Power Dissipation: 300mW
  • FET Technology: METAL-OXIDE SEMICONDUCTOR
  • Length: 1.05mm
  • FET Feature: Logic Level Gate
  • Subcategory: FET General Purpose Powers
  • Rise Time: 7.9 ns
  • Package / Case: SOT-963
  • Fall Time (Typ): 15.2 ns
  • Vgs(th) (Max) @ Id: 1.05V @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds: 14.1pF @ 15V
  • RoHS Status: ROHS3 Compliant
  • Number of Elements: 2
  • Mount: Surface Mount
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Number of Terminations: 6
  • Pin Count: 6
  • Peak Reflow Temperature (Cel): 260
  • Published: 2011
  • Gate to Source Voltage (Vgs): 10V
  • Factory Lead Time: 15 Weeks
  • Operating Temperature: -55°C~150°C TJ
  • Terminal Form: FLAT
  • Operating Mode: ENHANCEMENT MODE
  • Max Power Dissipation: 300mW
  • Width: 850μm
  • Drain-source On Resistance-Max: 3Ohm
  • Continuous Drain Current (ID): 240mA
  • FET Type: 2 N-Channel (Dual)
  • Turn On Delay Time: 3.8 ns
  • Drain Current-Max (Abs) (ID): 0.18A
  • Turn-Off Delay Time: 13.4 ns
  • Additional Feature: ESD PROTECTION
  • Rds On (Max) @ Id, Vgs: 3 Ω @ 100mA, 4.5V

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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