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- Manufacturer No：DMN2005K-7
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：DMN2005K-7
- SKU：1793286
- Description：Trans MOSFET N-CH 20V 0.3A 3-Pin SOT-23 T/R
User Guide
User Guide
DMN2005K-7 Details
Trans MOSFET N-CH 20V 0.3A 3-Pin SOT-23 T/R
DMN2005K-7 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- Radiation Hardening: No
- Terminal Position: DUAL
- Number of Pins: 3
- Terminal Form: GULL WING
- Factory Lead Time: 16 Weeks
- Terminal Finish: Matte Tin (Sn)
- Published: 2014
- Transistor Element Material: SILICON
- Height: 1mm
- Length: 2.9mm
- Technology: MOSFET (Metal Oxide)
- Transistor Application: SWITCHING
- Operating Mode: ENHANCEMENT MODE
- Operating Temperature: -65°C~150°C TJ
- Weight: 7.994566mg
- Subcategory: FET General Purpose Powers
- Current - Continuous Drain (Id) @ 25°C: 300mA Ta
- Vgs(th) (Max) @ Id: 900mV @ 100μA
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Number of Channels: 1
- Pbfree Code: yes
- JESD-609 Code: e3
- Number of Terminations: 3
- Pin Count: 3
- REACH SVHC: No SVHC
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 40
- Gate to Source Voltage (Vgs): 10V
- Element Configuration: Single
- Drain to Source Breakdown Voltage: 20V
- FET Type: N-Channel
- Width: 1.3mm
- Continuous Drain Current (ID): 300mA
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Power Dissipation: 350mW
- Vgs (Max): ±10V
- Power Dissipation-Max: 350mW Ta
- Drive Voltage (Max Rds On,Min Rds On): 1.8V 2.7V
- Rds On (Max) @ Id, Vgs: 1.7 Ω @ 200mA, 2.7V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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