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- Manufacturer No：DMG6601LVT-7
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Arrays
- Datasheet：DMG6601LVT-7
- SKU：1815705
- Description：MOSFET N/P-CH 30V 26TSOT
User Guide
User Guide
DMG6601LVT-7 Details
MOSFET N/P-CH 30V 26TSOT
DMG6601LVT-7 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Number of Channels: 2
- Mount: Surface Mount
- Pbfree Code: yes
- Contact Plating: Gold
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Number of Terminations: 6
- REACH SVHC: No SVHC
- Terminal Finish: Matte Tin (Sn)
- Max Junction Temperature (Tj): 150°C
- Published: 2009
- Factory Lead Time: 15 Weeks
- Drain to Source Breakdown Voltage: 30V
- Operating Temperature: -55°C~150°C TJ
- Packaging: Cut Tape (CT)
- Continuous Drain Current (ID): 2.5A
- Additional Feature: HIGH RELIABILITY
- JESD-30 Code: R-PDSO-G6
- FET Feature: Logic Level Gate
- Reference Standard: AEC-Q101
- Rise Time: 4.6 ns
- Polarity/Channel Type: N-CHANNEL AND P-CHANNEL
- Turn On Delay Time: 1.7 ns
- Power Dissipation: 850mW
- Turn-Off Delay Time: 18.3 ns
- RoHS Status: ROHS3 Compliant
- Number of Elements: 2
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- JESD-609 Code: e3
- Lead Free: Lead Free
- Terminal Position: DUAL
- Terminal Form: GULL WING
- Peak Reflow Temperature (Cel): 260
- Gate to Source Voltage (Vgs): 12V
- Width: 1.6mm
- Transistor Element Material: SILICON
- Height: 1mm
- Number of Pins: 26
- Length: 2.9mm
- Transistor Application: SWITCHING
- Operating Mode: ENHANCEMENT MODE
- FET Technology: METAL-OXIDE SEMICONDUCTOR
- Package / Case: SOT-23-6 Thin, TSOT-23-6
- Drain Current-Max (Abs) (ID): 3.8A
- Vgs(th) (Max) @ Id: 1.5V @ 250μA
- FET Type: N and P-Channel
- Fall Time (Typ): 2.2 ns
- Max Power Dissipation: 850mW
- Drain-source On Resistance-Max: 0.055Ohm
- Gate Charge (Qg) (Max) @ Vgs: 12.3nC @ 10V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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