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- Manufacturer No：ZVP3306FTC
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：ZVP3306FTC
- SKU：1834259
- Description：MOSFET P-CH 60V 0.09A SOT23-3
User Guide
User Guide
ZVP3306FTC Details
MOSFET P-CH 60V 0.09A SOT23-3
ZVP3306FTC Specification Parameters
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Elements: 1
- RoHS Status: RoHS Compliant
- JESD-609 Code: e3
- Part Status: Obsolete
- Number of Terminations: 3
- Terminal Form: GULL WING
- Peak Reflow Temperature (Cel): 260
- Reach Compliance Code: unknown
- Drive Voltage (Max Rds On,Min Rds On): 10V
- Element Configuration: Single
- Operating Temperature: -55°C~150°C TJ
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- Vgs (Max): ±20V
- JESD-30 Code: R-PDSO-G3
- Continuous Drain Current (ID): 90mA
- Turn On Delay Time: 8 ns
- Turn-Off Delay Time: 8 ns
- Weight: 7.994566mg
- Length: 3.04mm
- Feedback Cap-Max (Crss): 8 pF
- Power Dissipation-Max: 330mW Ta
- Current - Continuous Drain (Id) @ 25°C: 90mA Ta
- Input Capacitance (Ciss) (Max) @ Vds: 50pF @ 18V
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Number of Channels: 1
- ECCN Code: EAR99
- Lead Free: Lead Free
- Terminal Position: DUAL
- Qualification Status: Not Qualified
- Published: 2012
- Drain to Source Voltage (Vdss): 60V
- Time@Peak Reflow Temperature-Max (s): 10
- Transistor Element Material: SILICON
- Gate to Source Voltage (Vgs): 20V
- Terminal Finish: MATTE TIN
- Width: 1.4mm
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Power Dissipation: 330mW
- FET Type: P-Channel
- Height: 1.02mm
- Fall Time (Typ): 8 ns
- Rise Time: 8 ns
- Voltage - Rated DC: -60V
- Drain Current-Max (Abs) (ID): 0.09A
- Vgs(th) (Max) @ Id: 3.5V @ 1mA
- Rds On (Max) @ Id, Vgs: 14 Ω @ 200mA, 10V
- Current Rating: -90mA
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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