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- Manufacturer No：ZXMP10A17GTA
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：ZXMP10A17GTA
- SKU：10820496
- Description：MOSFET 100V P-Chnl UMOS
User Guide
User Guide
ZXMP10A17GTA Details
MOSFET 100V P-Chnl UMOS
ZXMP10A17GTA Specification Parameters
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- JESD-609 Code: e3
- Min Operating Temperature: -55°C
- Number of Pins: 4
- Pin Count: 4
- Terminal Form: GULL WING
- Peak Reflow Temperature (Cel): 260
- Terminal Finish: Matte Tin (Sn)
- Max Operating Temperature: 150°C
- Published: 2009
- Gate to Source Voltage (Vgs): 20V
- Packaging: Cut Tape (CT)
- Transistor Application: SWITCHING
- Subcategory: Other Transistors
- FET Type: P-Channel
- Length: 6.7mm
- Width: 3.7mm
- Turn On Delay Time: 3 ns
- Power Dissipation: 3.9W
- Rise Time: 3.5 ns
- Drain to Source Breakdown Voltage: -100V
- Turn-Off Delay Time: 13.4 ns
- Current Rating: -1.6A
- Input Capacitance (Ciss) (Max) @ Vds: 424pF @ 50V
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Channels: 1
- Radiation Hardening: No
- Lead Free: Lead Free
- Terminal Position: DUAL
- Number of Terminations: 4
- Pbfree Code: no
- REACH SVHC: No SVHC
- Drain to Source Voltage (Vdss): 100V
- Time@Peak Reflow Temperature-Max (s): 40
- Factory Lead Time: 13 Weeks
- Element Configuration: Single
- Part Status: Discontinued
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- Height: 1.65mm
- Vgs(th) (Max) @ Id: 4V @ 250μA
- Continuous Drain Current (ID): 2.4A
- Package / Case: TO-261-4, TO-261AA
- Max Power Dissipation: 3.9W
- Resistance: 350mOhm
- Voltage - Rated DC: -100V
- Fall Time (Typ): 7.2 ns
- Current - Continuous Drain (Id) @ 25°C: 1.7A Ta
- Gate Charge (Qg) (Max) @ Vgs: 10.7nC @ 10V
- Rds On (Max) @ Id, Vgs: 350m Ω @ 1.4A, 10V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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