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- Manufacturer No：XCKU035-3FBVA900E
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XCKU035-3FBVA900E
- SKU：5179000
- Description：1700CLBS Kintex® UltraScale™ 900-BBGA FCBGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 2.8mm 1V 0C~100C TJ
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XCKU035-3FBVA900E Details
1700CLBS Kintex® UltraScale™ 900-BBGA FCBGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 2.8mm 1V 0C~100C TJ
XCKU035-3FBVA900E Specification Parameters
- Part Status: Active
- Packaging: Bulk
- Surface Mount: YES
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- Factory Lead Time: 10 Weeks
- Technology: CMOS
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Supply Voltage: 1V
- JESD-609 Code: e1
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Height Seated (Max): 2.8mm
- Length: 31mm
- Number of Terminations: 900
- Operating Temperature: 0°C~100°C TJ
- Number of CLBs: 1700
- Series: Kintex? UltraScale?
- Number of Outputs: 468
- JESD-30 Code: S-PBGA-B900
- Number of LABs/CLBs: 25391
- Organization: 1700 CLBS
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Packing Method: Tray
- Qualification Status: Not Qualified
- Published: 2012
- HTS Code: 8542.39.00.01
- Terminal Form: BALL
- Power Supplies: 1V
- Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
- Subcategory: Field Programmable Gate Arrays
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Width: 31mm
- ECCN Code: 3A991.D
- Total RAM Bits: 19456000
- Package / Case: 900-BBGA, FCBGA
- Number of I/O: 468
- Number of Inputs: 468
- Voltage - Supply: 0.970V~1.030V
- Number of Logic Elements/Cells: 444343
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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