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- Manufacturer No：DMN62D0LFB-7
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：DMN62D0LFB-7
- SKU：1805421
- Description：Trans MOSFET N-CH 60V 0.1A Automotive 3-Pin DFN T/R
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User Guide
DMN62D0LFB-7 Details
Trans MOSFET N-CH 60V 0.1A Automotive 3-Pin DFN T/R
DMN62D0LFB-7 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- Radiation Hardening: No
- Lead Free: Lead Free
- Number of Terminations: 3
- Pin Count: 3
- Factory Lead Time: 16 Weeks
- DS Breakdown Voltage-Min: 60V
- Transistor Element Material: SILICON
- Gate to Source Voltage (Vgs): 20V
- Continuous Drain Current (ID): 100mA
- FET Type: N-Channel
- Transistor Application: SWITCHING
- Vgs (Max): ±20V
- Case Connection: DRAIN
- Vgs(th) (Max) @ Id: 1V @ 250μA
- Turn On Delay Time: 3.4 ns
- Feedback Cap-Max (Crss): 6 pF
- Drive Voltage (Max Rds On,Min Rds On): 1.5V 4V
- Fall Time (Typ): 16.3 ns
- Turn-Off Delay Time: 26.4 ns
- Input Capacitance (Ciss) (Max) @ Vds: 32pF @ 25V
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Number of Channels: 1
- Pbfree Code: yes
- Contact Plating: Gold
- JESD-609 Code: e4
- Number of Pins: 3
- REACH SVHC: No SVHC
- Drain to Source Voltage (Vdss): 60V
- Published: 2011
- Element Configuration: Single
- Terminal Position: BOTTOM
- Operating Temperature: -55°C~150°C TJ
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- Additional Feature: HIGH RELIABILITY
- Drain-source On Resistance-Max: 2Ohm
- Power Dissipation: 470mW
- Rise Time: 3.4ns
- Current - Continuous Drain (Id) @ 25°C: 100mA Ta
- Package / Case: 3-UFDFN
- Power Dissipation-Max: 470mW Ta
- Rds On (Max) @ Id, Vgs: 2 Ω @ 100mA, 4V
- Gate Charge (Qg) (Max) @ Vgs: 0.45nC @ 4.5V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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